PFIB-SEM dual beam system - FERA

The world’s first fully integrated Xe plasma source FIB with SEM.


FERA enables extremely high ion currents up to 2 μA thus increasing sputtering rate more than 50 times compared to conventional Ga source. This predetermines FERA3 for milling big volumes of materials that were time consuming or impossible so far.

This new generation of scanning electron microscopes equipped with focused ion beam column provides users with the advantages of the latest technology, such as new improved high-performance electronics for faster image acquisition, ultra-fast scanning system with compensation of static and dynamic image aberrations or built-in scripting for user-defined applications.

Modern Optics

  • A unique Wide Field Optics™ design with a proprietary Intermediate Lens (IML) offering a variety of working and displaying modes, for instance with enhanced field of view or depth of focus, etc.
  • Real time In-Flight Beam Tracing™ for the performance and beam optimization integrating the well-established software Electron Optical Design. It includes also direct and continual control of beam current and spot size.
  • Fully automated electron optics set-up and alignment
  • Fast imaging rate
  • Unique live stereoscopic imaging using advanced 3D Beam
  • Technology opens up the micro and nano-world for an amazing 3D experience and 3D navigation


High Performance Ion Optics

  • Sophisticated high performance plasma i-FIB system for both extremely fast and precise cross sectioning and material removal

FERA PFIB-SEM is supported by both the XM and the GM chamber/stage combination.



Advanced system features:

  • High brightness Schottky emitter for high-resolution / high-current / low-noise imaging
  • Sophisticated high performance plasma i-FIB system for both extremely fast and precise cross sectioning and material removal
  • Extraordinary resolution with powerful optional In-Beam SE Detector
  • Unique three-lens Wide Field Optics™ design offering the variety of working and displaying modes embodying the TESCAN proprietary Intermediate Lens (IML) for the beam aperture optimization
  • Real time In-Flight Beam Tracing™ for the performance and beam optimization integrating the well-established software Electron Optical Design. It includes also direct and continual control of beam spot size and beam current
  • Fast imaging rate
  • Beam Deceleration Technology (BDT) for excellent resolution at low beam voltages (optional)
  • In-Beam BSE Detector for BSE imaging at very short working distances (optional) suitable even for ferromagnetic samples imaging
  • High-throughput large-area automation, e.g. automated particle location and analysis
  • Superior specimen handling using a motorized compucentric stage
  • Ideal geometry for EDX and EBSD; non-distorted EBSD pattern
  • Fast and easy obtaining of the clean chamber vacuum by powerful turbomolecular and dry fore vacuum pump; electron gun pumping by ion getter pump
  • Fully automated microscope setup including electron optics setup and alignment
  • Network operations and built-in remote access/diagnostics, all come as the TESCAN standard
  • Unique live stereoscopic imaging utilizing the 3D Beam Technology
  • Extended low vacuum mode with chamber pressure up to 500 Pa for non-conducting specimens imaging
  • Unique ion-optical column differentially pumped (2 ion getter pumps) for ultra-low ion scattering effect
  • Motorized aperture changer in ion column with ultra-high reproducibility
  • Beam Blanker and Faraday cup included as standard accessories for ion column
  • Ultra-high resolution and excellent performance at high current with Xe Plasma i-FIB column
  • Automatic FIB cutting and signal acquiring followed by 3D reconstruction (tomography), allowing 3D EBSD, 3D EBIC etc. with integrated 3D visualization
  • Sophisticated software for SEM/FIB/GIS control, image acquisition, archiving, processing and analysis; multi-user environment localized in many languages

Standard:

  • SE Secondary electron detector Everhart-Thornley type (YAG Crystal)
  • Retractable BSE* Retractable annular backscattered electron detector scintillator type (YAG crystal) with high sensitivity and atomic number resolution (0.1)
  • pA Meter Probe Current Measurements
  • Touch Alarm Stops movements when sample touches any part of the chamber
  • IR TV Camera For live „Chamber View“
  • In-Beam BSE detector Annular scintillator based backscattered electron detector (YAG crystal) mounted in-column that enables to obtain BSE images at very short working distances and imaging of the milling process at the highest FIB current